1002 Red Office Avenue
Edison, New Jersey 1175
SUMMARY I am an engineering student with the ability to handle difficult technical situations as well as excellent problem-solving and decision-making skills. Also, I am proficient in analytical skills and project management. Capacity to work autonomously as well as a member of a team.
Boise State University, Idaho, U.S. January 2014-to date B.Sc. Mechanical Engineering, expected May 2018
Minor: Advanced IC Packaging Technology Development
Relevant coursework Thermo-mechanical multi-physics Modeling and measurements of IC packaging and related areas. Analytical and measurement methods. Material properties and material property test methods. Numerical simulation (non-linear deformation, viscous behavior, etc.).
Finite Element Modeling (FEM)
Computational Fluid Dynamics (CFD) in related ...